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Tin/Lead (Sn 62) Solder Paste

 

Introduction

Sn62 Solder Paste is a Halide Free, No Clean Solder Paste & RMA Type; formulated to leave completely invisible residue of the flux. This product has a superior wetting capabilities. The paste can be used in both Stencil Design and Printer Operation.

Alloy

BT Uses Low Oxide spherical powder composed of Sn/Pb/Ag in a standard type - III Mesh Size.  The weight ratio of the flux to solder powder is referred to as the metal load typically in the range of 88-92% for standard alloy. 

Storage And Handling

Refrigerated storage will prolong the shelf life of Solder Paste. The shelf life of the paste is 6 months. Solder Paste should be allowed to reach ambient working temperature prior to use. Generally paste should be removed from refrigeration at least 2 hrs before use. 

Re-Flow

This profile is designed for use with Sn62/Pb36/Ag2. It will serve as general guideline in establishing a re-flow profile. Adjustments to this profile may be necessary based on specific process requirements.

Product Specification

MATERIAL: 62/36/02 Sn/Pb/Ag Solder Paste. 

TYPE: No Clean (RMA)

REFERENCE SPECIFICATION: ANSI-J-STD-004 RELO

Physical Properties

STANDARD ALLOY: 62/36/02

POWDER MESH SIZE / SHAPE: -325 + 500, 25 Microns, Spherical, TYPE-III

METAL CONTENT: 88 +92%

FLUX PERCENT: 12+12-8%

Other Parameters

CORROSION: Passes Copper Mirror Corrosion Test

HALIDE DETECTION TEST: Passes CHROMATE PaperTest

HALIDE CONTENT: NIL

INSULATION RESISTANCE: SIR 7 DAYS  @ 85 C 85% RH-10" MEGA OHMS

SOLUBILITY / WASHABILITY: ISO PROPYLE ALCOHOL

STORAGE: STORE IN REFRIGERATION @ 15° C

SHELF LIFE: 6 MONTHS UNDER REFRIGERATION

 

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  • Solder Paste